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Products » PASTES AND GROUND COATINGS » INSTA-STIK MP » USING
APPLYING OF INSTA-STIK ÌÐ ADHESIVE

Before apply starting:
  • Air and basis temperature (+ 5 °Ñ äî + 50 °Ñ ).
  • Wear protective gloves.
  • The surfaces, especially the metallic, should be dry and clean .
  • Surface structure strength, over which the adhesive will be apply, as well as it’s bearing capacity should be checked before starting (especially when applied vertically to walls).
  • 1. Shake well for about 30 sec. before usage 2. Turn the vial upside down and screw it on the PU spray gun outlet. Hold the vial at a vertical position when applying.

    3. Adhesive applying:

    À) Lay on stripes of the adhesive over the wall or the floor or over the insulation board at 20-25cm.

  • At least 3 stripes of a board, if the adhesive is laid vertically on a long side of insulation board.
  • apply the adhesive stripes on wall or insulation board always vertically.


  • Á) When applying on outdoor facade and thermo-insulation systems it is recommended adhesive to be applied on the board perimeter and:

  • 1 at the middle, following W – figurative movement.
  • 2 at parallel longitudinal stripes in a closed area of the perimeter.


  • Requirement: You should have 40 % adhesive coverage on a thermo-insulation board surface, after pressing it to the wall.


    4. Thermo-insulation boards pasting:

    The insulation boards can be pasted on the wall not later than 10 min. and not earlier than 4 min. after adhesive applying.

    Fastening time of INSTA-STIK ÌÐ depends on the t°and humidity. That’s why it is recommended to test the specific time of the fastening before using.
    The insulation attaching does by propping it at bottom and pressing close to the wall. Insulation boards pasting does downside up.

    Use metallic level for surface leveling. You will have not opportunity for re-positioning after 20-40min.

    Vertical
    applying of
    TI boards
    Horizontal
    applying of
    TI boards
    Vertical applying
    of TI boards on
    uneven surface
    Vertical applying
    of TI boards under
    zero elevation
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